Program Background:

In today's industrial manufacturing towards intelligence and precision, a millimeter of dimensional deviation is enough to affect the performance and life of the product. Traditional measurement means are limited by single-point inspection, low efficiency, environmental interference and other issues, it is difficult to meet the modern production line on the 100% full inspection, zero defect delivery of the stringent needs. The innovative application of spectral sensors, with micron-level precision and multi-dimensional online inspection capability, is opening a new door of high-precision and high-efficiency quality inspection for the global manufacturing industry.

While traditional laser sensors can only acquire single-point height data, spectral sensors upgrade the measurement dimension across the board by rapidly scanning the spectrum to hit the spot:

1. Sub-micron precision: Z-axis repeatability of ±1.5 μm at a constant temperature of 23°C, accurately capturing microscopic shape changes such as turbine blade thickness fluctuations and flexible screen fit gaps.

2. 3D contour modeling: Combining active laser spectral encoding and structured light point cloud synchronization technology, the 3D reconstruction of complex surfaces is completed within 0.2 seconds, and 12 key parameters, such as contour, flatness, height difference, etc., are directly output.

3. Penetration detection: Short-wave infrared (SWIR) band can penetrate the surface coating, oxide film, and directly analyze the metal substrate or internal package structure, solving the industry problem that traditional optical sensors are interfered by the surface state.

Practical application scenarios for spectral sensors

1. Semiconductor Packaging: The Life and Death of Nanoscale Precision

• Wafer warpage (recognizes 0.1° inclination)
• Solder ball height uniformity (generates heat map of thickness distribution)
• Micron-level distortion of leadframes

2. 3C electronic assembly: “invisible guardian” invisible to the naked eye

• Cell phone bezel-to-glass fit inspection: Identify 15μm-level gaps to prevent the risk of screen breakage.
• Precision Screw Assembly Monitoring: Compare the amount of screw protrusion with spectral reflectance characteristics to prevent leakage/misassembly.
• Flexible screen curved surface lamination: Synchronized analysis of morphology and delamination defects to increase yield rate by 40%.

3. Automotive components: a bastion of quality for high-intensity production

• Turbine blade casting inspection: penetrate the oxide film to directly measure the thickness of the substrate, sorting speed increased by 3 times
• Li-ion battery top cover welding quality inspection: 0.5 seconds to complete the weld width, collapse depth of the full circumference scanning
• Stamped parts rebound compensation: real-time generation of thickness maps and feedback to the press, mold debugging cycle shortened by 70%.