The core functions of the 3D white light interferometric profilometer include high-precision 3D topography reconstruction, surface roughness analysis, step height measurement, geometric dimensioning and tolerancing inspection, defect identification and classification, multi-region stitching measurement, and automated batch processing. Specific features are as follows:

1. High-Precision 3D Topography Reconstruction

Based on the principle of white light interference, this system achieves sub-nanometer resolution (Z-axis resolution down to 0.1 nm) for micro-topography measurement by analyzing the optical path difference between reflected light from the sample surface and reference light. Supports diverse surface types including transparent, opaque, coated, and uncoated surfaces, covering a vertical measurement range from 0.1 nm to 10 mm. It can also perform stitching measurements on large samples exceeding 100 mm. For instance, in semiconductor manufacturing, it precisely captures 1 nm-level height fluctuations and 5 nm-level line width variations in photolithography patterns on wafer surfaces.

2. Surface Roughness Analysis

Automatically calculates parameters such as Ra (arithmetic mean roughness) and Rz (maximum height roughness), supporting two-dimensional or three-dimensional topography display. For ultra-smooth surfaces (e.g., optical components), Ra measurement accuracy is ≤0.1 nm, meeting nanoscale surface quality assessment requirements. In metal processing, it detects surface roughness on machined surfaces and after sandblasting, providing data support for process optimization.

3. Step Height Measurement

Using phase-shifting interferometry algorithms, high-precision repeatable measurements of micrometer-scale steps are achieved. For steps smaller than 2μm, repeatability error is <0.1% at the 1σ standard, with height measurement accuracy of ±1nm. For example, in MEMS device manufacturing, it can precisely measure thin-film thickness or interlayer height differences.

4. Geometric Dimensioning and Geometric Tolerance Inspection

Supports 3D measurement of geometric parameters including curvature, flatness, straightness, and roundness, compliant with GB/T 13380-2007 standards. In precision machining, it verifies the machining quality of mold micro-surfaces or automotive components, ensuring dimensional accuracy meets design requirements.

5. Defect Identification and Classification

Real-time detection of surface defects such as scratches and dents, combined with machine vision algorithms to automatically identify defect types (e.g., line width necking, edge serration) and calculate edge roughness (LER ≤ 0.5nm). In the 3C electronics sector, it evaluates surface defects on touch panels or LED screens to enhance product yield rates.

6. Multi-area stitching measurement

Capable of seamlessly stitching thousands of images, supporting multiple stitching modes including square, circular, annular, and spiral configurations. Utilizing a precision XY scanning platform, it completes 3D imaging of a 5mm×5mm area on a 300mm wafer within 6 minutes, covering hundreds of lithography pattern cells to meet large-area inspection requirements.

7. Automated Batch Processing

Supports single-area, multi-area, stitching, and automated measurement modes. Customizable array configurations enable batch processing of hundreds or thousands of measurement points. Integrated operation software allows preset parameter configuration, automatic data statistics, and report export to enhance inspection efficiency.