In the field of industrial automation and precision manufacturing, vision inspection technology has become the core means to ensure product quality and improve production efficiency. With the semiconductor, electronic assembly, precision machinery and other industries on tiny parts detection accuracy and speed requirements continue to improve, the traditional single lens vision system gradually showed limitations. For this reason, multi-camera telecentric vision inspection program came into being, through innovative optical design, intelligent algorithms and system integration, for industrial inspection has brought a revolutionary breakthrough.

The solution is based on multi-centric lens module as the core, combined with special lighting technology, high sensitivity CCD imaging and integrated control software, to realize high-precision imaging and real-time positioning of products. The program is described as follows:

(1) Co-design of multiple telecentric lenses

Multiple telecentric lenses are synchronized to cover a larger inspection area in an array layout, while maintaining high resolution and low distortion. The “object-side telecentric” design of the telecentric lens eliminates the parallax caused by the change of object distance and ensures that objects in different positions can be clearly imaged, which is especially suitable for dimensional measurement and defect detection of precision parts.

(2) Intelligent lighting and imaging optimization

Combining multi-spectrum LED light source and dynamic dimming technology, it provides customized lighting solutions for objects with different materials and surface characteristics. For example, dark field illumination is used for reflective materials to suppress glare, and backlighting is used for transparent components to enhance contour contrast. ccd cameras ensure temporal and spatial consistency of multi-camera images through high-speed synchronized triggering.

(3) Software Algorithm and System Integration

The control software integrates multi-image fusion algorithms, sub-pixel edge detection and 3D coordinate reconstruction functions to synthesize complete inspection results from multi-lens data in real time. The system supports dynamic switching of ROI (region of interest), which can automatically adjust the inspection strategy according to the product characteristics and significantly improve the inspection efficiency.

Program Advantages

1, millisecond-level high-speed alignment: parallel acquisition of multiple lenses and pipelined image processing algorithms, so that the detection speed to the millisecond level, to meet the real-time needs of high-speed production lines.

2, micron-level detection accuracy: telecentric optical design combined with sub-pixel algorithms to achieve ** ± 1μm ** positioning accuracy, which can accurately capture tiny defects below 0.1mm.

3, user-friendly interface and real-time feedback: visualization interface supports real-time adjustment of parameters and dynamic display of inspection results, operators can quickly get started without professional programming.

4, low resource consumption and high stability: optimized algorithms to reduce the dependence on computer hardware, with fanless industrial computer, to ensure that the system in the harsh environment of long-term stable operation.

5, flexible compatibility and scalability: support and mainstream PLC seamless, compatible with Modbus, Ethernet/IP and other communication protocols. Hardware modular design allows rapid replacement of lenses or sensors, adapted to different sizes of products.

6, a wide range of industry applicability: applicable to semiconductor packaging, FPC / PCB testing, precision machinery assembly and other scenarios, especially in screen printing machines, exposure machines, dispensing machines, laminating machines and other equipment, excellent performance.

Application Scenarios

1. Semiconductor package inspection: In BGA solder ball alignment and chip pin coplanarity inspection, the multi-lens synergistic solution can realize synchronous inspection with full field of view, which significantly improves the yield rate.

2. FPC/PCB Precision Positioning: Used for microvia alignment and line defect identification of flexible circuit boards, supporting high-precision inspection of complex curved surfaces.

3. Precision mechanical assembly: During the assembly of micro gears, bearings and other parts, real-time feedback on positional deviation guides the robotic arm to complete assembly with sub-millimeter precision.

4. Automated production lines: When integrated into screen printing machines, it can dynamically compensate for substrate deformation during the printing process to ensure accurate ink position.