In the field of material science and industrial inspection, traditional microscopes are limited by the optical principle, the depth of field is usually only micron-level, and when facing uneven samples, it is necessary to repeatedly adjust the focus to capture local details. Ultra-depth-of-field metallographic microscopes can extend the depth of field up to 20 times more than traditional equipment, and have 3D modeling and AI analysis technology.

Depth of Field Difference

1. Conventional microscopes can only present a clear picture on a fixed focal plane. When observing complex samples such as cracks on metal surfaces and three-dimensional structures of semiconductor chips, the bumps and undulations will cause some areas to be blurred.

2. Ultra-depth-of-field metallurgical microscope adopts digital microscope technology, through high-precision sensors along the Z-axis continuous scanning, to obtain a sequence of images of different focal planes, and then use optical phase modulation and depth synthesis algorithms, these images in the clear part of the accurate fusion, and ultimately generate a full-area clear three-dimensional image.

Example: In 12-inch wafer inspection, traditional equipment requires multiple focus adjustments to identify particle contamination at the 0.3μm level, while super depth-of-field technology can complete full-surface imaging with a single scan, increasing inspection efficiency by three times.

3D Modeling

While conventional devices only provide a planar projection, super depth-of-field technology can reconstruct the surface topography of a sample through multi-angle imaging and depth-of-field extension.

AI Intelligent Analytics

While traditional testing relies on manual judgment, the Ultra View device automatically identifies sample characteristics through AI algorithms.