On precision manufacturing production lines, dimensional inspection of mass-produced parts has long presented a dilemma: calipers are inefficient and data is difficult to trace; while coordinate measuring machines (CMMs) offer high precision, they require frequent sampling and provide delayed feedback. With 1.5-micrometer-level accuracy and the ability to generate batch reports with a single click, the POMEAS image measuring system has opened up a third path for the electronics and hardware industry that balances speed and accuracy.

Batch Measurement, No Need to Focus on Each Item Individually

With traditional imaging systems, inspecting multiple parts requires refocusing and repositioning for each part, making the process cumbersome. The POMEAS image measuring system utilizes a dual-telecentric optical system with a large depth of field, enabling clear imaging of multiple parts within the field of view on the same focal plane, regardless of their orientation. Operators simply place a full tray or loose parts on the stage, press the start button, and the system automatically identifies each part, matches it to a preset template, and completes the simultaneous acquisition and evaluation of all measurement parameters within seconds.

Generate Inspection Reports with a Single Click; Data is Automatically Uploaded to the System

Once the measurement is complete, the device automatically generates a structured inspection report that includes the measured values, nominal values, deviations, and pass/fail results for each part. The report supports common formats such as PDF and Excel and can be uploaded directly to MES or enterprise quality management systems via the network, enabling a transition from “manual data entry” to “automatic archiving.” For factories required to submit shipment inspection reports to customers, this feature significantly reduces the time spent on document organization and makes data traceability a reality.

1.5-micron Accuracy, from Sampling to 100% Inspection

The 1.5-micron repeatability is achieved through the deep integration of hardware and software: a dual-telecentric optical path eliminates perspective distortion, ensuring consistent imaging scale at any point within the field of view; a sub-pixel edge detection algorithm takes contour positioning accuracy to new heights. This means that not only can the critical dimensions of individual parts be controlled, but even minute variations among parts in a batch can be detected, allowing process deviations to be identified early and preventing batch defects.

Redefining Inspection Processes to Unlock Quality Value

By deploying image measurement systems at the front end of production lines or during final inspection, a single device can handle batch dimensional measurement tasks for multiple parts. Operators can perform these tasks independently after minimal training, eliminating the need for dedicated metrology staff. The freed-up personnel can then focus on higher-value quality assurance tasks, such as process monitoring and anomaly analysis, transforming the quality inspection process from a reactive check to proactive control.

Adaptability to Multiple Scenarios

The equipment is widely used for connector terminals, precision stamped parts, powder-metallurgy gears, injection-molded connectors, card holders, and various types of micro-structural components.